Postdoc in Climatic Reliability of Electronic Devices

Danmarks Tekniske Universitet (DTU)

Ph.d. & forskning

Frist 5. april 2019

The Materials and Surface Engineering section in the Department of Mechanical Engineering at the Technical University of Denmark is seeking candidates for a postdoc position in the field of Corrosion Reliability of Electronic Systems and Devices starting from the 1 June 2019.

The position is part of the CreCon industrial consortium on climatic reliability of electronics, therefore it involves close collaboration with industrial partners.

Humidity influence on corrosion reliability of electronics is a serious issue today due to the wide spread usage of electronics, which results in exposure to various climatic conditions. Printed Circuit Board Assembly (PCBA) is the main component of electronics that get influenced by humidity due to water film formation under transient climate conditions such as humidity and temperature as well as due to several inherent factors of the PCBA itself. Electrical property of the water film is essentially determined by the electrochemical aspects of the micro-cell formed on the PCBA surface when water film connects between neighboring biased points such as soldered connections or legs of components. The water film thickness formed under humid conditions can vary from nm scale to hundredths of nanometer depending on the humidity, temperature, hygroscopic residues, and PCBA parameters. Failure of electronics is determined by the interplay of these electrochemical sequences resulting in a parasitic circuit of different capacity interfering with the electrical aspects of the PCBA. Therefore understanding and controlling the water film build up, and knowledge on sequential changes in the electrochemical aspects leading to a critical level of parasitic current is important in controlling the humidity related failures in electronics.

Responsibilities and tasks
The intended Postdoc will focus on understanding the interplay between electrochemical mechanisms and failure of electronic devices due to change in electrical functionality under humid conditions due to thin water film formation. Work will involve investigations at PCBA and System level. Experimental methods involve electrochemical impedance and DC electrochemical methods to understand the electrochemical properties of the water film and interaction with PCBA surface. System level investigations will include humidity profiling inside the device in response to external conditions, and extrapolation of its effects on PCBA reliability.

Candidates should have

  • A PhD Degree (or equivalent) in Materials Engineering with corrosion and electrochemistry specialization or master degree in electronics with PhD level expertise on humidity robustness of electronics or related topics. Prior experience on work related to corrosion reliability of electronics is an advantage.
  • Documented research or industrial experience in corrosion and electrochemistry or reliability of electronics specifically related to humidity effects in also an advantage.
  • The capacity and interest to work in a multidisciplinary team including academia and industry

We offer
DTU is a leading technical university globally recognized for the excellence of its research, education, innovation and scientific advice. We offer a rewarding and challenging job in an international environment. We strive for academic excellence in an environment characterized by collegial respect and academic freedom tempered by responsibility.

Salary and terms of employment
The appointment will be based on the collective agreement with the Danish Confederation of Professional Associations. The allowance will be agreed upon with the relevant union. The period of employment is 2 years.

You can read more about career paths at DTU here.

Further information
Further information may be obtained from Professor Rajan Ambat, telephone: +45 4525 2181, e-mail:

You can read more about Department of Mechanical Engineering on, corrosion reliability of electronics research at

Application procedure
Please submit your online application no later than 5 April 2019 (local time). Applications must be submitted as one PDF file containing all materials to be given consideration. To apply, please open the link "Apply online", fill out the online application form, and attach all your materials in English in one PDF file. The file must include:

  • Application (cover letter)
  • CV
  • Diploma (MSc/PhD)
  • List of publications

Applications and enclosures received after the deadline will not be considered.

All interested candidates irrespective of age, gender, disability, race, religion or ethnic background are encouraged to apply.

DTU Mechanical Engineering covers the fundamental engineering disciplines within Solid mechanics, Fluid mechanics, Coastal and Maritime Engineering, Energy systems and energy conversion, Materials and Surface Engineering, Manufacturing Engineering, Engineering design and Product development. The department has a scientific staff of about 150 persons, 95 PhD students and a technical/administrative support staff of about 80 persons.

DTU is a technical university providing internationally leading research, education, innovation and scientific advice. Our staff of 6,000 advance science and technology to create innovative solutions that meet the demands of society, and our 11,200 students are being educated to address the technological challenges of the future. DTU is an independent academic university collaborating globally with business, industry, government and public agencies.

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Danmarks Tekniske Universitet (DTU) - hurtigt overblik

Danmarks Tekniske Universitet (DTU)
Danmarks Tekniske Universitet (DTU)
DTU er et teknisk eliteuniversitet med international rækkevidde og standard. Vores mission er at udvikle og nyttiggøre naturvidenskab og teknisk videnskab til gavn for samfundet. 11.200 studerende uddanner sig her til fremtiden, og 6.000 medarbejdere har hver dag fokus på uddannelse, forskning, myndighedsrådgivning og innovation, som bidrager til øget vækst og velfærd.

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