Responsibilities and scope:
• Contributed as a senior specialist in a small, highly technical team developing advanced 6" glass wafer-level stacked planar integrated optics
• Worked closely with equipment suppliers and external partners on process definition, tooling, and manufacturability
• Scaled technologies from proof-of-concept to prototype and high-volume production (HVP) readiness
• Supported production development with a strong focus on reliability, quality control, and process robustness
• Acted as technical contributor in internal and external project meetings, presenting results and recommendations
Key achievements:
• Developed and demonstrated advanced assembly and stacking solutions for 6" glass wafer-level integrated optics
• Successfully validated stacking, assembly, and singulation processes from early proof-of-concept to production-ready workflows
• Defined innovative methodologies for stacking, singulation, and pick-and-place operations
• Established effective collaborations with internal and external process design experts
• Introduced reliability standards and quality control measures, improving process maturity and manufacturability

Responsibilities and scope:
• Implementing of a QA 8D-methodology as an attempt to improve QC & QA
Key achievements:
• Implemented Successfully implemented QA 8D-methodology
• Improving quality control standards.
• Conducted failure analysis on drone mechanical system

Responsibilities and scope:
• Acted as principal technical contributor in the development of next-generation solid oxide electrolysis cell (SOEC) stacks
• Worked closely with equipment suppliers to define, evaluate, and mature process solutions and tooling
• Supported scale-up of unit operations in collaboration with internal and external process design experts
• Prepared detailed technical specifications enabling dual sourcing of critical SOEC stack components
• Supported production development activities while maintaining oversight of relevant academic and patent literature
• Represented the project in internal and external technical meetings, presenting results and recommendations
Key achievements:
• Maintained technical momentum and knowledge sharing during Covid restrictions by proactively organizing structured team discussions
• Identified and resolved a critical missing Non-Disclosure Agreement (NDA), mitigating significant technical and commercial risk
• Initiated and led a focused project group addressing BTO/conditioning, strengthening process understanding and robustness

Responsibilities and scope:
• Acted as Design-for-Manufacturing specialist supporting SMT and thick-film ceramic substrate production
• Acted as technical interface to international equipment suppliers during specification, procurement, and acceptance.
• Conducted comprehensive market surveys and technical evaluations of Automated Optical Inspection (AOI) systems
• Initiated and drove a MEMS microphone project, enhancing functionality, quality, and manufacturability of hearing aid components
• Took short-notice responsibility for thick-film ceramic substrate production line processes
• Led the market survey, procurement, FAT & SAT of a high-temperature electrical ceramic substrate furnace sourced from China
• Optimized production workflows, achieving a 35% reduction in process time through elimination of non-value-adding steps
• Addressed and resolved multiple critical production-halt issues (“company showstoppers”)
• Performed comprehensive process FMEA (pFMEA) on thick-film electronic and ceramic substrate processes
Key achievements:
• Selected and implemented the preferred AOI system, completing FAT and SAT successfully
• Initiated and integrated a MEMS microphone project into Widex’s high-end product portfolio
• Streamlined operations and introduced LEAN practices in the ceramic chip stack department
• Delivered the HT-furnace project on schedule, restoring stable production after critical issues
• Conducted and documented pFMEA on the ceramic hybrid chip stack, reviewed and approved by colleagues & management

Responsibilities and scope:
• Responsible for reliability testing, failure analysis, and quality control of printed circuit boards, amplifiers, and electrical/mechanical subcomponents across multiple hearing aid platforms
• Collaborated closely with internal and external stakeholders to ensure robust qualification and production readiness
• Acted as technical contributor at the interface between R&D, production, and quality, supporting robust product introduction and lifecycle management
• Developed and industrialized a hydrophobic nanocoating technology, including definition of a production-ready method for accurate thickness measurement
• Initiated and drove a MEMS microphone project aimed at improving robustness, cost efficiency, and functional performance of hearing aid components
• Conducted applied R&D activities supporting materials selection, process stability, and long-term reliability
Key achievements:
• Delivered all quality and reliability activities on schedule across multiple product families and concurrent projects
• Established a stable and repeatable nanocoating process, significantly improving product robustness and process control
• Developed and implemented a method for quantitative polymer thickness measurement in production
• Successfully integrated a MEMS microphone solution into Oticon’s high-end hearing instrument brands

Responsibilities and scope:
• Held full technical, operational, and safety responsibility for advanced surface science and thin-film research laboratories
• Specified, procured, and executed FAT and SAT of advanced UHV and thin-film deposition equipment, including an RF/DC Magnetron Sputtering system (AJA, USA)
• Debugged, repaired, and maintained complex UHV systems, including full electrical system troubleshooting and recovery after major water damage
• Operated and maintained multiple UHV chambers used for AES and XPS analysis
• Served as the technical point of contact for internal staff, international guest researchers, students, vendors, and DTU technical services
• Acted as laboratory safety officer, responsible for gas handling (N2, H2, O2), vacuum systems, and high-voltage equipment
• Managed laboratory logistics and global supply chain coordination, including:
o Procurement of UHV components, pumps, chambers, and spare parts
o Management of sputter targets (Au, Ag, Pt, Ti, Cr, Cu, Al, Pd, W, Sr, etc.)
o Coordination with gas suppliers (AGA) and international vendors
• Trained and supervised students, PhD candidates, and researchers from Europe, Asia, and the USA in the safe and correct use of advanced laboratory equipment within a shared research facility
Key achievements:
• Successfully installed, commissioned, and maintained state-of-the-art sputtering and surface analysis infrastructure
• Ensured stable, safe, and high-uptime laboratory operation despite critical infrastructure failures
• Established the laboratory as a reliable platform for international collaboration and advanced materials research

Responsibilities and scope:
• Acted as a technical specialist supporting manufacturing and engineering teams, working closely with software and electrical engineers
• Served as a technical interface between R&D, manufacturing, and external partners during qualification and production ramp-up.
• Developed and executed reliability test plans for hybrid microsystem assemblies
• Performed advanced failure analysis using 3D X-ray micro-tomography and Scanning Electron Microscopy (SEM)
• Conducted detailed electrical testing to assess component and system-level performance
• Proposed and evaluated alternative technical strategies to improve production yield and robustness
• Trained operators in test operation procedures and measurement methodologies
• Utilized COMSOL Multiphysics to perform FEM simulations, reducing reliance on trial-and-error experimentation
• Identified and mitigated stress- and strain-related risks in new chip and package designs
Key achievements:
• Performed comprehensive electrical characterization of stacked hybrid silicon dies and PCBs before and after qualification testing
• Developed and implemented a new standard for archiving measurement data sheets, improving traceability and consistency
• Trained operators in executing advanced electrical testing and measurement procedures
• Authored and co-authored multiple validation and verification reports
• Supported software engineers in troubleshooting LabVIEW-based measurement systems
• Edited and translated a comprehensive FEM report (German ? English) on thermal stress & strain in Si-dies mounted on PCBs
• Established collaboration with an external subcontractor for non-destructive X-ray tomography analysis
• Authored backend delivery specification reports for Phonak’s next-generation silicon dies
• Conducted FEM analysis of thermal stresses in chip stacks, using COMSOL Multiphysics in collaboration with ETH Zürich

Responsibilities and scope:
• Managed a small R&D team (two PhDs and two M.Sc. physicists) developing micro- and nanoscale 4-point probes for sheet resistance measurements on ultra-shallow junctions
• Led development of a pick-and-place method for bare microchips, transferring dies from wafer to custom-designed holders, resolving a critical company roadblock
• Drove probe lifetime testing and production maturation, improving robustness and manufacturability
• Performed advanced surface science analysis (AES, XPS, TOF-SIMS) to identify and quantify atomic-scale metal contamination after probe engagement
• Acted as technical interface to international customers and suppliers, supporting qualification of probes for use in leading semiconductor cleanroom facilities
• Supported customer qualification processes for deployment of novel probe technology in international semiconductor fabs
Key achievements:
• Executed full cleanroom processing of probes from bare silicon wafer to final product
• Improved probe production yield together with the team from a low level to approximately 90%
• Collaborated with a US-based sub-supplier to design and implement an automated pick-and-place solution for bare dies
• Demonstrated and documented that probe engagement lifetime exceeded the lowest tolerance by more than 50%
• Proved through detailed analysis and reporting that atomic-scale metal contamination after probe engagement was below 10¹² atoms/cm², securing approval from world-leading semiconductor manufacturers

Responsibilities and scope:
• Developed and implemented advanced wafer-level MEMS assembly technologies, including automated XYZ underfill dispensing, fluxless prebonding, and vacuum reflow soldering
• Designed and validated specialized taping and dicing methodologies for fragile MEMS transducer wafers
• Led the transfer of novel assembly technologies from prototype and pilot production into cleanroom high-volume production
• Defined and optimized reflow, prebonding, vacuum soldering, taping, and dicing processes for 6" silicon chip-to-wafer hybrid MEMS transducer systems
• Selected to train and onboard new cleanroom operators and engineers from Europe, Asia, and Africa during global production ramp-up
• Acted as technical owner for assembly processes, supporting production ramp-up, yield optimization, and long-term process stability
Key achievements:
• Established a dicing procedure allowing protective dicing tape in direct contact with 1 µm thin membranes without damage during tape removal
• Achieved fluxless prebonding and vacuum reflow soldering in a controlled gas environment, guided by FEM analysis of molten solder geometries
• Developed a method to underfill 6" wafers without inducing tensile stress, wafer bending, or fracture after curing
• Devised advanced dicing strategies enabling reliable cutting through underfill and populated silicon wafers, eliminating critical dicing errors
• Resolved multiple production-critical “showstoppers”, enabling stable high-volume manufacturing
• Increased MEMS microphone dicing yield from approximately 1% to 99.5%

Responsibilities and scope:
• Performed single-mode fiber pigtailing, beam profiling, and optical loss measurements (insertion loss, reflection loss, and polarization-dependent loss)
• Investigated the impact of temperature and humidity on the optical performance of DWDM prototypes and TE/TM beam splitters
• Led development from concept to pilot production for integration of DWDM electronics using flip-chip solder bonding of Al2O3 thick-film substrates to flex print and rigid PCBs
• Supported optical packaging, alignment, and reliability assessment of optoelectronic components
Key achievements:
• Successfully executed manual flip-chip bonding of an 80-channel InGaAs detector array to flex print and rigid PCB, meeting critical deadlines for a major prototype demonstration